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55x35cm Heat Insulation Silicone Pad Desk Mat Maintenance Platform For Mobile Phone BGA Soldering Repair

Item Code: IP4476
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  • Description
55x35cm Heat Insulation Silicone Pad Desk Mat Maintenance Platform For Mobile Phone BGA Soldering Repair
 

Parameters:

Size: 55 x 35 cm
Type: Heat insulation pad
Net weight: 648 g  
Thickness: about 5 mm
Heat resistance: 500 °C
Material: Environmentally friendly organosilicone
 
Size: approx. 240 X 220 X 8 mm/9.45 X 8.66 X 0.31 in 
Color: Blue 
Weight: approx. 400 g 
Heat Resistance: 500°C 
Application: Motherboard and chipset maintenance  
Color: Blue
 
Features:
Resistance to high temperature of 500 °C.
Sevaral hole locations for setting screws, IC chips and small parts.
Built-in scale ruler (0 ~ 36 cm ) on bottom section.
Make your repair work easy.
A good partner for hot air gun.
Only some small section is magnetic (marked on the pad), and can be used to hold screws firmly.
It is a bit weak, NOT so strong magneti
 
Packing:
1 piece 55 x 35cm Heat Insulation pad or 1 piece   240X220CM    Heat Insulation pad , not  2 pieces
Tools On the pad is NOT included