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MiJing Z20 10 in 1 Middle Layer Reball Platform Motherboard BGA Tin Mobile Phone Repair Fixture For iPhone X XS XS 11 12 Pro Max

Mijing Z20 10 in 1 BGA Reballing Stencil Platform Fixture for iPhone 12 11 pro X XS Max Motherboard Frame Planting Tin Template
$20.00
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1 Pieces(Min. Order)
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Description
Description
MiJing Z20 10 in 1 Middle Layer Reball Platform Motherboard BGA Tin Mobile Phone Repair Fixture For iPhone X XS XS 11 12 Pro Max
 

Description:

1. Support for iPhone X-12promax
2. it used for positioning and reballing PCB BGA parts
3. Convenient and faster for reballing BGA without any damage, offer you best solution BGA reballing and repairing.


How to use

1. Install the iPhxne X-12/12 pro main board on the platform
2. Cover the iPhxne X-12/12 pro BGA reballing stencil on mainboard
3. Evenly spread tin on the cover of the reballing stencil
4. Remove the reballing stencil cover
5. Take out the motherboard and cooperate with the hot air gun to solidify the tin point.

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