1. Support for iPhone X-12promax
2. it used for positioning and reballing PCB BGA parts
3. Convenient and faster for reballing BGA without any damage, offer you best solution BGA reballing and repairing.
How to use
1. Install the iPhxne X-12/12 pro main board on the platform
2. Cover the iPhxne X-12/12 pro BGA reballing stencil on mainboard
3. Evenly spread tin on the cover of the reballing stencil
4. Remove the reballing stencil cover
5. Take out the motherboard and cooperate with the hot air gun to solidify the tin point.