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Qianli 4 IN 1 Middle Frame BGA Reballing Stencil Platform For iPhone 14 Series

Qianli 4 IN 1 Middle Frame BGA Reballing Stencil Platform For iPhone 14 / 14 Pro MAX/14 Plus Motherboard Tin Template Soldering Fixture
$24.00
/ Pieces
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1 Pieces(Min. Order)
Quantity
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Description
Description
Qianli 4 IN 1 Middle Frame BGA Reballing Stencil Platform For iPhone 14 / 14 Pro MAX/14 Plus Motherboard Tin Template Soldering Fixture

  • 4-in-1 Middle frame reballing platform, precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge, for iPhone 14/14 Plus/14Pro/14Pro Max

  • To show the beauty of design in a compact shape, motherboard reballing without worry is compact and easy, saving space

  • Magnet sliding dislocation design, smart application of the sliding dislocation design, easy to take

  • CNC high-precision integrated processing, stable positioning for the motherboard, no deviation in reballing

  • Strong magnetic attraction, accurate positioning no offset, and encountering high-temperature magnetism will not weaken

  • High-temperature magnetic strong pressing prevents the stencils from bulging caused by high temperature

  • Avoiding SIM card base not being tinned while the motherboard is tinned

  • Imported selection of high-quality steel material, manufacture under QianLi black stencils standard, wear resistance, ultra high toughness to support reballing

  • Square chamfer mesh, prevent the tin balls from being stuck in the mesh

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