4-in-1 Middle frame reballing platform, precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge, for iPhone 14/14 Plus/14Pro/14Pro Max
To show the beauty of design in a compact shape, motherboard reballing without worry is compact and easy, saving space
Magnet sliding dislocation design, smart application of the sliding dislocation design, easy to take
CNC high-precision integrated processing, stable positioning for the motherboard, no deviation in reballing
Strong magnetic attraction, accurate positioning no offset, and encountering high-temperature magnetism will not weaken
High-temperature magnetic strong pressing prevents the stencils from bulging caused by high temperature
Avoiding SIM card base not being tinned while the motherboard is tinned
Imported selection of high-quality steel material, manufacture under QianLi black stencils standard, wear resistance, ultra high toughness to support reballing
Square chamfer mesh, prevent the tin balls from being stuck in the mesh